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LED Package-use Encapsulation Material Report – 2013
  • LED-use Silicone Encapsulant Market Forecast
    • Overall
      • Volume (Kg), Value ($ million)
    • Volume and Value – by type
      • Phenyl, Methyl, Others
    • In-depth Analysis of Silicone Encapsulant Markets by Region
      • South Korea, Taiwan, China, Japan, EMEA, Americas
      • Volume (by type – Phenyl, Methyl, Others)
      • Value (by type - Phenyl, Methyl, Others)
  • LED Encapsulant Supply Chain Analysis
    • Supply Chain Analysis by Region
      • South Korea, Taiwan, China, Japan, EMEA, Americas

If the demand for packaged LED used in TV backlight units (BLU) had led the LED encapsulant market up until 2012, the tides have turned with the opening of the LED lighting market, as demand for packaged LED used in LED lighting is now the key driver of the LED encapsulant market growth.

The size of packaged LED for lighting is relatively larger than that of packaged LED for BLU, thus more encapsulants are used. With this, the growth of the LED lighting market is boosting the consumption of LED encapsulants.

With high output power, high brightness and superior thermal characteristics, demand for LED-use silicone encapsulants is forecast to nearly double to 855 tons by 2017, compared to 442 tons in 2012. LED-use silicone encapsulants can largely be categorized into phenyl and methyl types. Phenyl types are used in BLU, while methyl types are applied mainly in mobile phones, monitors, and tablet PCs. Both types are used for LED lighting, while the relatively high heat-resistant methyl types are increasingly used.

IHS researched the overall encapsulants for packaged LED, as well as their characteristics and function by type. This report also analyzes the current market and provides the market outlook. This should provide informative research to companies dealing with LED encapsulants and/or those involved in the LED material industries.

LED Package-use Encapsulation Material Report – 2013
Frequency Special
Updated 2013. 12
Page 81P
Format    

 

I. Introduction 
II. Production and molding process of packaged LED 
 Overview of packaged LED  
 Categorization of packaged LED  
 Production process of packaged LED 
 Overview of packaged LED molding process 
 Molding type of packaged LED  
  Casting molding 
  Dispensing molding 
  Transfer molding 
  Injection molding 
  Screen printing molding 
 Molding apparatus for packaged LED 
III. LED encapsulants 
 Overview of encapsulants 
 Type of packaged LED encapsulants  
 Concept and characteristics of epoxy encapsulants 
 Concept and characteristics of silicone encapsulants
IV. Supply chain analysis 
 Overall 
 Supply chain analysis by region 
  South Korea 
  Japan 
  Taiwan/China 
  EMEA/Americas 
V. LED encapsulant market forecast
 Overall 
  Volume 
  Value 
  Volume – by type (epoxy/silicon) 
  Value – by type (epoxy/silicon) 
  Volume – by region 
  Value – by region 
 LED encapsulant price forecast
VI. LED silicone encapsulant market forecast 
 Overall 
  Volume 
  Value 
  Volume – by type (epoxy/silicon) 
  Value – by type (epoxy/silicon) 
  Volume – by region 
  Value – by region 
 South Korea 
  Volume 
  Value 
  Volume – by type (phenyl/methyl/others)   
  Value – by type (phenyl/methyl/others) 
 Taiwan 
  Volume 
  Value 
  Volume – by type (phenyl/methyl/others) 
  Value – by type (phenyl/methyl/others)  
 Japan 
  Volume 
  Value  
  Volume – by type (phenyl/methyl/others)  
  Value – by type (phenyl/methyl/others) 
 China 
  Volume 
  Value  
  Volume – by type (phenyl/methyl/others) 
  Value – by type (phenyl/methyl/others)  
 EMEA 
  Volume  
  Value  
  Volume – by type (phenyl/methyl/others) 
  Value – by type (phenyl/methyl/others)
 Americas 
  Volume 
  Value 
  Volume – by type (phenyl/methyl/others)
  Value – by type (phenyl/methyl/others) 

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Sales Inquiry for APAC region : technology_apac@ihs.com
Sales Inquiry for Americas region : technology_us@ihs.com
Sales Inquiry for EMEA region : technology_emea@ihs.com

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