The Display Driver IC (DDI), one of parts for flat panel displays (FPDs), is not subordinated to the display industry because it derives from the semiconductor industry; however, the DDI is a core component necessary to take the role of driving the screen of display devices, and creates a huge ground accounting for more than 20% of the total display component and material market.

After suffering a severe shortage of DDI supply in 2003, display manufacturers have built up a strategic purchasing chain for stable supply and a number of companies that are fascinated by the DDI market have been mushrooming. Driven by the oversupply contributing to the increase in DDI capacity, DDI prices have plunged since 2005, and this has eventually led to revenue deteriorations and has even caused some companies to discontinue their line operations.

From the supply standpoint, approximately 3.9 billion DDIs were shipped in 2005, and this figure is predicted to reach 5.8 billion units by 2009. In terms of demand, wafer consumed is likely to surge from about 4 million units to 5.6 million units for the corresponding period.

Displaybank research intends to define the DDI industry situation (current status of supply/demand and profit structure) accurately, and share the future industry outlook, with the aim of becoming a help to the DDI industry development.

The report does not simply calculate demand for DDIs as a figure depending on panel demand, but forecast the demand taking into account DDI technology development trends and design shrink trends, and capacity and demand of wafer, which is a crucial part for DDIs, by design rule. In addition, capacity balance to respond to worldwide production capacity (fab and bump) is surveyed and revenue trends per wafer are analyzed in consideration of average selling price trend for DDIs and process development trends, in an attempt to help subscribers predict the future marketability of DDIs.

DDI Revenue Trend (2004~2009)

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<Report Inquiries>
Andy Yoo : andy@displaybank.com

<Table of Contents>

1. Prologue

1.1. Introduction
1.2. Business Overview

2. FPD Market

2.1. Overall FPD Market
2.2. LCD Market by Display Type
2.3. LCD Market by Application
2.4. OLED Market by Display Type

3. 2005 DDI Shipment Result

3.1. DDI Shipment for Large Panel
3.2. DDI Shipment for Small/Medium Panel

4. 8Q DDI Shipment (2004.3Q~2006.2Q)

4.1. Overall DDI Shipment
4.2. a-Si TFT for Large Panel (L-TFT)
* Source Driver IC Golden Number Rule
4.3. a-Si TFT Single Chip Solution (S-TFT)
4.4. LTPS TFT for Small Panel (S-LTPS)
4.5. LTPS TFT for Large Panel (L-LTPS)
4.6. Color STN (CSTN)
4.7. Mono STN (MSTN)
4.8. PMOLED
4.9. DDI Shipment by Design Rule

5. DDI Demand Forecast (2006.3Q~2009.4Q)

5.1. Overall Annual Growth Estimation
5.2. L-TFT DDI Demand
5.3. S-TFT DDI Demand
5.4. L-LTPS DDI Demand
5.5. S-LTPS DDI Demand
5.6. CSTN DDI Demand
5.7. MSTN DDI Demand
5.8. PMOLED DDI Demand
5.9. AMOLED DDI Demand
5.10. Design Shrink Forecast
5.11. Pad Pitch Forecast for S-TFT

6. Wafer Demand Forecast

6.1. Methodology
6.2. Overall Wafer Demand Forecast
6.3. Wafer Demand for L-TFT DDI
6.4. Wafer Demand for S-TFT DDI
6.5. Wafer Demand for CSTN DDI
6.6. Wafer Demand for MSTN DDI
6.7. Wafer Demand for L-LTPS DDI
6.8. Wafer Demand for S-LTPS DDI
6.9. Wafer Demand for PMOLED
6.10. Wafer Demand for AMOLED
6.11. Wafer Demand by Process Design Rule

7. Price & Revenue Trend

7.1. ASP Trend
7.2. Revenue Trend
7.3. Wafer Revenue Trend

8. Cost Structure

8.1. Large a-Si TFT Source Driver IC
8.2. Small a-Si TFT All in One Driver IC

9. Summary (2004~2009)

10. Driver IC Supply Chain

10.1. Small TFT, LTPS, STN
10.2. Large TFT

11. Manufacturing (FAB, Bump) Status

11.1. High Process Roadmap
11.2. FAB Total Capacity for DDI Manufacturer
11.3. FAB DDI Capacity Allocation
11.4. FAB Capacity vs. Wafer Demand Balance
11.5. Bump Capacity
11.6. Bump Demand vs. Capacity

12. Technology Trend

12.1. Technology for Large TFT DDI
12.2. Technology for Small TFT DDI
12.3. Technology for Others

13. Conclusion

13.1. Standardization
13.2. Alliance
13.3. Outsourcing & Localization
13.4. Conclusion